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Two-dimensional (2D) semiconductors could be used to build advanced 3D chips based on monolithic 3D integration. But challenges related to growing single-crystalline materials at low temperatures — as well as enhancing the performance of 2D transistors — need to be addressed first.
Three-dimensional technology — which can offer enhanced integration density and improved data communication — will be required to build large-scale artificial computing systems inspired by the brain.
The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.
