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3D integration of 2D electronics

Nature Reviews Electrical Engineering (2024)Cite this article

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Abstract

The adoption of three-dimensional (3D) integration has revolutionized NAND flash memory technology, and a similar transformative potential exists for logic circuits, by stacking transistors into the third dimension. This pivotal shift towards 3D integration of logic arrives on the heels of substantial improvements in silicon device structures and their subsequent scaling in size and performance. Yet, advanced scaling requires ultrathin semiconducting channels, which are difficult to achieve using silicon. In this context, field-effect transistors based on two-dimensional (2D) semiconductors have drawn notable attention owing to their atomically thin nature and impressive performance milestones. In addition, 2D materials offer a broader spectrum of functionalities — such as optical, chemical and biological sensing — that extends their utility beyond simple ‘more Moore’ dimensional scaling and enables the development of ‘more than Moore’ technologies. Thus, 3D integration of 2D electronics could bring us unanticipated discoveries, leading to sustainable and energy-efficient computing systems. In this Review, we explore the progress, challenges and future opportunities for 3D integration of 2D electronics.

Key points

  • 2D electronics must overcome several challenges before they can be adopted in commercial semiconductor chips. Some of the major challenges are discussed in the section ‘Towards very-large-scale integration of 2D electronics’.

  • Research efforts in 2D material synthesis and device integration strategies must happen synergistically, with the goal of 3D integration, because silicon technology is already mature, with the most advanced nodes reaching the limits of planar integration in gate-all-around field-effect transistors.

  • 3D integration with 2D electronics not only demands the maturity of 2D electronics in the planar dimension but also poses new difficulties in the vertical direction. These difficulties must be thoroughly understood and addressed before 2D materials can be introduced into commercial electronics.

  • 2D materials have the potential to enable multifunctional chips by combining logic with memory and sensing in a 3D-integrated chip. Multifunctional chips containing 2D electronics should be developed with the goal of manufacturing task-specific semiconductor chips and thereby addressing various integration challenges.

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Fig. 1: Evolution of silicon technology and 2D electronics.
Fig. 2: 3D Integration of 2D electronics.
Fig. 3: Applications of 3D integration of 2D electronics.
Fig. 4: Design considerations and challenges for 3D integration with 2D electronics.

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  1. Darsith Jayachandran

    Present address: IBM Research, Albany, NY, USA

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  1. Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, PA, USA

    Darsith Jayachandran, Najam U Sakib & Saptarshi Das

  2. Department of Electrical Engineering, The Pennsylvania State University, University Park, PA, USA

    Saptarshi Das

  3. Department of Materials Science and Engineering, The Pennsylvania State University, University Park, PA, USA

    Saptarshi Das

  4. Materials Research Institute, The Pennsylvania State University, University Park, PA, USA

    Saptarshi Das

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Jayachandran, D., Sakib, N.U. & Das, S. 3D integration of 2D electronics. Nat Rev Electr Eng (2024). https://doi.org/10.1038/s44287-024-00038-5

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