Abstract
DURING the electro-deposition of copper, it has been observed that if a plate cathode is caused to move at certain steady speeds through the electrolyte so that the latter is flowing across its surface, the copper is sometimes deposited in marked ridges along the lines of flow of the liquid. This is obviously due to the attainment of steady conditions in the streaming away of the copper-denuded cathodic layer of electrolyte and its replacement by fresh and more concentrated solution, from which deposition is more rapid.
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References
Ogilvie, Aeronautics, June (1912).
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HARRISON, E., GOLLOP, H. Motion of Liquid around an Obstacle during Electro-Deposition. Nature 137, 234–235 (1936). https://doi.org/10.1038/137234b0
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DOI: https://doi.org/10.1038/137234b0
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