Abstract
CERTAIN ‘intermediates’, when placed between a substrate and an evaporated gold film, promote adhesion between the film and the substrate1. As a preliminary part of a systematic study of the nature of the chemical interactions in such systems, it was necessary to examine the effect of varying the temperature of the substrate during deposition of gold in the absence of intermediates. The interactions at the ceramic substrate-gold interface were examined with the potassium bromide pellet infrared spectroscopy technique.
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References
Holland, L., Vacuum Deposition of Thin Films (John Wiley, New York, 1956).
Hunt, J. M., Wisherd, M. P., and Bonham, L. C., Anal. Chem., 22, 1478 (1958).
Eischens, R. P., and Pliskin, W. A., Adv. Catalysis, 10, 1 (1958).
Carpenter, L. G., and Mair, W. N., Nature, 179, 212 (1957). Clark, D., Dickinson, T., and Mair, W. N., Trans. Faraday Soc., 55, 1937 (1959).
Hertzberg, G., Molecular Spectra and Molecular Structure, 1 (D. Van Nostrand Company, New York, 1960).
Brand, J. C. D., and Speakman, J. C., Molecular Structure (E. Arnold Ltd., London, 1960).
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GUERRA, C., HEALY, T. & FUERSTENAU, D. Spectroscopic Evidence of Chemical Interactions at the Gold Film–Silica Substrate Interface. Nature 207, 518–520 (1965). https://doi.org/10.1038/207518a0
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DOI: https://doi.org/10.1038/207518a0
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